INSULATION RESISTANCE AT REFERENCE TEMP | 10000.0 MEGOHMS |
NONDERATED OPERATING TEMP | -55.0 CELSIUS MINIMUM AND 150.0 CELSIUS MAXIMUM |
NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 25.0 DC SINGLE SECTION |
BODY DIAMETER | 0.150 INCHES NOMINAL |
BODY LENGTH | 0.031 INCHES NOMINAL |
BODY STYLE | CHIP TYPE |
CAPACITANCE VALUE PER SECTION | 39.000 PICOFARADS SINGLE SECTION |
CASE MATERIAL | CERAMIC |
DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 2.500 |
PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACES GOLD |
RELIABILITY INDICATOR | NOT ESTABLISHED |
SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS | -750.0 SINGLE SECTION |
TERMINAL LENGTH | 0.150 INCHES NOMINAL |
TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
TERMINAL SURFACE TREATMENT | SOLDER |
TEST DATA DOCUMENT | 96214-531452-8 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS | -100.0 TO 100.0 SINGLE SECTION |
TOLERANCE RANGE PER SECTION | -20.00 TO 20.00 PERCENT SINGLE SECTION |