BODY HEIGHT | 0.050 INCHES MINIMUM AND 0.065 INCHES MAXIMUM |
BODY LENGTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
DESIGN FUNCTION AND QUANTITY | 2 BUFFER, NAND |
FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND WIRE-OR OUTPUTS |
INCLOSURE CONFIGURATION | FLAT PACK |
INCLOSURE MATERIAL | CERAMIC AND GLASS |
INPUT CIRCUIT PATTERN | DUAL 4 INPUT |
OUTPUT LOGIC FORM | DIODE-TRANSISTOR LOGIC |
MAXIMUM POWER DISSIPATION RATING | 60.0 MILLIWATTS |
OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
PRECIOUS MATERIAL | GOLD |
PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACES GOLD |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
TERMINAL SURFACE TREATMENT | GOLD |
TIME RATING PER CHACTERISTIC | 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS MAXIMUM POWER SOURCE |